Technology
Plasma Enhanced Chemical Vapor Deposition
Plasma enhanced chemical vapor deposition (PECVD) is a technique used to deposit thin films directly from a gas state onto a solid substrate. Plasma deposition methods typically balance the benefits of extended coating times with the negatives of surface ablation that occurs with extended plasma exposure.
Most plasma deposition methods use a continuous discharge to create the plasma state. However, extended exposure can begin to erode, not only the newly formed coating, but also the underlying material.
AeonClad’s advanced proprietary process eliminates surface ablation by rapidly creating a protective polymer layer upon which any number of films can be deposited.
Pulsed Plasma Enhanced Chemical Vapor Deposition
Pulsed plasma enhanced chemical vapor deposition (PPECVD) is a modification of traditional PECVD. Radio frequency pulsing (the plasma on and off times or the duty cycle) and deposition time allows for the fine control of the nature of films, such as film thickness and surface composition.
The AeonClad technology is protected by multiple issued and pending patents.
The AeonClad Difference
AeonClad employs proprietary plasma polymerization methods to create controlled surfaces for a variety of materials. These highly defined surfaces are created with a variable duty cycle pulsed radio frequency (RF) plasma technique.
A simplified approach is offered with many advantages when compared to traditional coating processes.
The AeonCoat™ technology offers the following benefits:
- Creates highly tunable and reproducible plasma coatings
- Affords excellent film thickness and film composition control
- A wide range of surface chemistries
- Tight control of surface density
- An extremely gentle, labile and room temperature process
- A single-step, solvent free all-dry process
AeonClad delivers a broad spectrum of chemical functionality on a wide variety of substrates. AeonClad scientists are experts at controlling both the nature and surface density of specific functional groups introduced during the plasma treatment process, allowing for systematic adjustment of surface chemistries to control interactions at virtually any interface.
AeonClad’s proprietary technique for pulsed RF plasma deposition provides the flexibility to produce many types of coatings using a single method.
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