Technology

Plasma Enhanced Chemical Vapor Deposition

Plasma enhanced chemical vapor deposition (PECVD) is a technique used to deposit thin films directly from a gas state onto a solid substrate. Plasma deposition methods typically balance the benefits of extended coating times with the negatives of surface ablation that occurs with extended plasma exposure.

Most plasma deposition methods use a continuous discharge to create the plasma state. However, extended exposure can begin to erode, not only the newly formed coating, but also the underlying material.

AeonClad’s advanced proprietary process eliminates surface ablation by rapidly creating a protective polymer layer upon which any number of films can be deposited.

Pulsed Plasma Enhanced Chemical Vapor Deposition

Pulsed plasma enhanced chemical vapor deposition (PPECVD) is a modification of traditional PECVD.  Radio frequency pulsing (the plasma on and off times or the duty cycle) and deposition time allows for the fine control of the nature of films, such as film thickness and surface composition.

By determining the optimum duty cycle, coating time, monomer mixture, and peak deposition rate, AeonClad can custom tailor virtually any surface to meet your specifications.

The AeonClad technology is protected by multiple issued and pending patents.